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Effects of high-dose Ge ion implantation and post- implantation annealing on ZnO thin films

机译:大剂量Ge离子注入和注入后退火对ZnO薄膜的影响

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摘要

This paper reports that ion implantation to a dose of 1 x 10~(17) ions/cm~2 was performed on e-axis-orientated ZnO thin films deposited on (0001) sapphire substrates by the sol-gel technique. After ion implantation, the as-implanted ZnO films were annealed in argon ambient at different temperatures from 600 — 900℃. The effects of ion implantation and post-implantation annealing on the structural and optical properties of the ZnO films were investigated by x-ray diffraction (XR.D), photoluminescence (PL). It was found that the intensities of (002) peak and near band edge (NBE) exitonic ultraviolet emission increased with increasing annealing temperature from 600 — 900℃. The defect related deep level emission (DLE) firstly increased with increasing annealing temperature from 600 — 750℃, and then decreased quickly with increasing annealing temperature. The recovery of the intensities of NBE and DLE occurs at ~ 850℃ and ~ 750℃ respectively. The relative PL intensity ratio of NBE to DLE showed that the quality of ZnO films increased continuously with increasing annealing temperature from 600 — 900℃.
机译:本文报道了通过溶胶-凝胶技术对沉积在(0001)蓝宝石衬底上的e轴取向ZnO薄膜进行了1 x 10〜(17)离子/ cm〜2剂量的离子注入。离子注入后,将注入的ZnO薄膜在氩气环境中于600至900℃的不同温度下退火。通过X射线衍射(XR.D),光致发光(PL)研究了离子注入和注入后退火对ZnO薄膜结构和光学性能的影响。结果表明,随着退火温度从600 — 900℃升高,(002)峰强度和近能带边缘(NBE)声波紫外发射强度增加。与缺陷有关的深能级发射(DLE)首先随着退火温度从600 — 750℃升高而升高,然后随着退火温度升高而迅速降低。 NBE和DLE的强度分别在〜850℃和〜750℃下恢复。 NBE与DLE的相对PL强度比表明,随着退火温度从600 — 900℃升高,ZnO薄膜的质量不断提高。

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