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Hot pressing effect on (Bi0·25Sb0·75)2Te3 mechanical and thermoelectric properties

机译:热压对(Bi 0·25 Sb 0·75 2 Te 3 的机械和热电性能的影响

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(Bi0·25Sb0·75)2Te3 thermoelectric material is a well known p type of compound that has higher figure of merit than other stoichiometries. The crystal of this compound was prepared, pulverized in a particle size ratio of 64% with a mesh of 80 (200 μm2) and 36% with a mesh of 60 (250 μm2). The powder was sintered in a heat up to 350–500°C under pressure of 500 MPa (hot pressing). To find out the temperature effects on thermal conductivity of the sample it was systematically investigated in nano-scale intrinsic structures by systems of X-ray diffraction, scanning electron microscopy and, for only once successful attempt, atomic force microscopy. The acquired images ensured to show homogeneous structures for hot pressed samples. In terms of thermal conductivity and with regard to the figure of merit (Z), optimum sintering temperature hovers at around 500°C, which leads to a maximum Z value of around 1·53 K−1.
机译:(Bi 0·25 Sb 0·75 2 Te 3 热电材料是一种众所周知的p型具有比其他化学计量更高的品质因数的化合物。制备该化合物的晶体,以80%(200μm 2 )的网眼以64%的粒径比和以60(250μm 2 < / sup>)。粉末在500 MPa的压力下于350-500°C的高温下烧结(热压)。为了找出温度对样品热导率的影响,已通过X射线衍射,扫描电子显微镜和原子力显微镜(只有一次成功尝试)系统地对纳米​​级固有结构进行了系统研究。所获取的图像确保显示出热压样品的均匀结构。就热导率和品质因数(Z)而言,最佳烧结温度徘徊在500°C左右,这导致Z值的最大值约为1·53 K -1

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