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Thermoelectric properties enhancement of p-type composite films using wood-based binder and mechanical pressing

机译:使用木质基粘合剂和机械加压增强p型复合膜的热电性能

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摘要

Thermoelectric generators (TEGs) fabricated using additive manufacturing methods are attractive because they offer the advantages of scalability, lower cost, and potentially higher power density than conventional TEGs. Additive manufacturing of TEGs requires active thermoelectric particles to be dispersed in a polymer binder to synthesize printable slurries, and printed films to be subsequently subjected to a long and high temperature curing to enhance their thermoelectic properties. A large amount of polymer binder present in composite films results in a sizable loss in the electrical conductivity. In addition, a long and high-temperature film curing results is a slow and energy intensive fabrication process. In this work, we demonstrate the feasibility of using a small amount (≤10−3 wt ratio) of novel nanofiber cellulose (NFC) as a binder to provide sufficient adhesion strength to hold the TE particles together in the composite films. We also demonstrate a pressure induced densification process to enhance the thermoelectic properties of printed composite films. This novel approach has the potential to fundamentally transform the manufacting method for printing TEGs by eliminating the need of long-duration and high-temperature curing. A higher applied pressure leads to a compact packing and densification of films resulting in an improvement in the electrical conductivity. The highest power factor achieved for best performing p-type thermoelectric-NFC composite film subjected to pressure induced densification is 611 μW/m-K2.
机译:使用增材制造方法制造的热电发电机(TEG)具有吸引力,因为与传统的TEG相比,它们具有可扩展性,更低的成本以及潜在的更高的功率密度等优点。 TEG的增材制造需要将活性热电颗粒分散在聚合物粘合剂中以合成可印刷的浆料,然后对印刷的薄膜进行长时间和高温固化以增强其热电性能。存在于复合膜中的大量聚合物粘合剂导致相当大的电导率损失。另外,长时间且高温的膜固化结果是缓慢且耗能的制造过程。在这项工作中,我们证明了使用少量(≤10 −3 wt比)的新型纳米纤维纤维素(NFC)作为粘合剂以提供足够的粘合强度以将TE颗粒保持在一起的可行性。复合膜。我们还演示了压力诱导的致密化过程,以增强印刷复合膜的热电性能。通过消除长时间和高温固化的需要,这种新颖的方法有可能从根本上改变印刷TEG的制造方法。较高的施加压力导致紧密的包装和薄膜的致密化,从而导致电导率的改善。压力诱导致密化的性能最佳的p型热电-NFC复合膜的最高功率因数为611μW/ m-K 2

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