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首页> 外文期刊>Berkeley technology law journal >LG ELECTRONICS, INC. V. BIZCOM ELECTRONICS, INC.: SOLVING THE FOUNDRY PROBLEM IN THE SEMICONDUCTOR INDUSTRY
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LG ELECTRONICS, INC. V. BIZCOM ELECTRONICS, INC.: SOLVING THE FOUNDRY PROBLEM IN THE SEMICONDUCTOR INDUSTRY

机译:LG ELECTRONICS,INC。诉BIZCOM ELECTRONICS,INC .:解决半导体行业中的基础问题

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摘要

Smaller chip designers cannot afford to operate manufacturing plants. Instead, they hire manufacturers to build their designs and sell back chips made to the designer's specifications. In an effort to secure "patent peace" and focus on innovation, leading semiconductor manufacturers entered blanket cross-licensing agreements in the 1980s and 1990s. The combination of contract manufacturing and these broad licensing agreements creates "the foundry problem," in which a third-party competitor can free-ride on the licensing agreements between patentees and foundries to gain access to technologies without negotiating their own license. A recent case, LG Electronics, Inc. v. Bizcom Electronics, Inc., demonstrated how carefully defined licensing agreements can overcome the foundry problem. This Note analyzes the foundry problem and the solution employed by LG Electronics as compared to other approaches. It also recommends further devices a patent licensor can use to avoid the foundry problem.
机译:较小的芯片设计人员无力运营制造工厂。取而代之的是,他们雇用制造商来构建自己的设计,并售回符合设计者要求的芯片。为了确保“专利和平”并专注于创新,领先的半导体制造商在1980年代和1990年代签订了全面的交叉许可协议。合同制造和这些广泛的许可协议的结合产生了“代工问题”,第三方竞争者可以在专利权人和代工厂之间自由使用许可协议来获得技术访问权,而无需协商自己的许可。最近的案例LG电子公司诉Bizcom电子公司证明了精心定义的许可协议可以克服铸造问题。本注释与其他方法相比,分析了LG Electronics的代工问题和解决方案。它还建议专利许可人可以使用其他设备来避免铸造问题。

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