SMT, SMD Technologies Meet Portable Device Requirements

摘要

Technologies for microminiaturization of and incorporation of high levels of function and features into chip parts including surface-mountable devices (SMD) have advanced with the progress of surface-mounting technology (SMT). At the same time, mounting of parts is being done with higher density as set manufacturers develop compact, lightweight, and multifunction mobile devices, such as mobile phones. Parts makers have expanded their miniaturization efforts, while seeking ways to reduce the number of parts used. Meanwhile, the market for composite chips is expanding, as demand grows for high-function and multi-function devices in the digital household electric appliance and automobile electronics sectors.