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Fujitsu's Flip-Chip Mounting Technique Has Fine-Pitch at Core

机译:富士通的倒装芯片安装技术的核心间距很小

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摘要

Flip-chip mounting technology applications have been expanding from high-end equipment to digital consumer products as a key technology for realizing high-density, size reduction, high-performance, and low cost. This paper describes Fujitsu Limited's efforts in this area with the focus on flip-chip mounting technology adopted by the company.
机译:倒装芯片安装技术的应用已从高端设备扩展到数字消费产品,这是实现高密度,缩小尺寸,高性能和低成本的关键技术。本文以富士通有限公司在此领域的努力为重点,重点介绍了该公司采用的倒装芯片安装技术。

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