Siemens Touts Innovation in New SIPLACE Placement System

摘要

For NEPCON China, Siemens AG will display the new SIPLACE X-Series with an innovative placement head and the SIPLACE D-Series, which has already earned high acclaim with its best-in-class features.rnThe new SIPLACE X-Series powered by SIPLACE MultiStar placement head delivers the ideal combination of chip shooting speed along with extensive com-rnponent range capability required for flexible end-of-line placement. This all-on-one solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.