SIPLACE Setup Center 4.0: More Process Reliability in Electronics Manufacturing

摘要

The SIPLACE Setup Center 4.0 is a new and improved version of its software for setup verification and fill-level management. Additional improvements for placement processes involving light-emitting diode (LED) are featured in the SIPLACE Setup Center 4.0. Functions include keeping track of LED brightness classes as component parameters, triggering automated refills via the well-known SIPLACE OIB interface, listing alternative components if not enough primary components are available, enforcing dual verification before and after splicing, checking and displaying fill levels for the current placement process, as well as providing data for the traceability of modules and components. The SIPLACE Setup Center 4.0 increases efficiency and productivity by improving the reliability of setup processes online and offline, resulting in seamless and error-free setup processes.