Dow Corning Toray Markets Three-Grade 150mm SiC Wafer

摘要

Dow Corning Toray Co., Ltd. has recently released three grades of 150-mm (6-inch) diameter silicon carbide (SiC) wafers, letting users to select the grade of the wafer quality. The company offers products in three grades: Prime Standard, Prime Select, and Prime Ultra, which are classified according to the amount of defects. Dow Corning Toray follows strict standards in rating wafer defects. This makes it possible for users to select an optimal SiC wafer based on the necessary performance and cost. SiC wafer defects are critical because they not only reduce device yields, but also degrade the device characteristics. In general, only the micropipe density (MPD) is used as a standard. In addition, the company uses threading screw dislocations (TSD) and basal plane dislocations (BPD) as standards as well. SiC power semiconductors have been actively researched and developed in recent years as a technology that would reduce power conversion losses and effectively use energy.