"Taiwanese manufacturers will be the first to achieve 10nm and narrower line width in integrated circuits," Nicky C. C. Lu, Chairman, Taiwan Semiconductor Industry Association (TSIA), made aggressive statements at a news conference at SEMICON Taiwan 2016 held in Taipei on Sept. 6. Taiwanese semiconductor manufacturers are taking a leading role not only as conventional outsourced production bases but also in leading-edge technological development. A major trend also seen at the show in terms of packaging technology is the full adoption of chips made from Fan-Out-Wafer Level Package (FOWLP) by Apple Inc. for its iPhone 7 model.
展开▼
机译：台湾半导体工业协会（TSIA）主席卢毅伟（Nicky CC Lu）在9月于台北举行的SEMICON Taiwan 2016的新闻发布会上发表了激进的声明：“台湾制造商将是率先实现10nm和更窄集成电路线宽的制造商。 6.台湾半导体制造商不仅在传统的外包生产基地中扮演着领导角色，而且在尖端技术发展中也扮演着领导角色。展会上在包装技术上也看到了一个主要趋势，即苹果公司为其iPhone 7型号完全采用了由扇出晶圆级封装（FOWLP）制成的芯片。
展开▼
