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Trillion-Node Engine loT Platform Hinges on No-Solder Connectors

机译:万亿节点发动机批次铰接在禁止焊接连接器上

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摘要

Toshiba Electronic Devices & Storage Corporation has developed two connector technologies that allow easy, solder-free assembly of internet of things (IoT) nodes, which are essential to realize the Trillion-Node Engine, an open-source IoT platform. Positive evaluations resulted from the tests conducted of the connector. Toshiba will continue the development and will use the connectors in a demonstration unit for the company's motor control drivers.The future of IoT is expected to be driven not only by expert engineers developing IoT devices for industry, but also by non-engineers creating IoT devices to handle all kinds of tasks. Realizing this will require an IoT development platform that allows individuals to quickly and easily embody their ideas and to create IoT prototypes. The platform should also support the development of small, lower power IoT sensor nodes that can be customized to handle various functions and applications. Toshiba and the University of Tokyo are presently evaluating the Trillion-Node Engine as an open IoT platform, and have found it to offer strengths in terms of ease of use.One notable challenge to be overcome is further miniaturization of IoT nodes,particularly their connectors, which are comparatively large and require precise soldering by a professional. If an IoT system connects printed circuit boards (PCBs) and motors, a wire harness is needed between the PCBs and motors. The connection between the wire harness and PCBs will result in a terminal block 8mm high, which is too large for an IoT platform.
机译:东芝电子设备和存储公司开发了两种连接器技术,可以轻松,无焊接互联网(物联网)节点,这对于实现万亿节点发动机是一个开源IOT平台至关重要。由连接器进行的测试产生的正值评估。东芝将继续开发,并将在公司的电机控制驱动程序中使用连接器。由于专家工程师开发了工业工程师,而且由非工程师创建IoT设备的专家工程师,而且预计IoT的未来是预期的。处理各种任务。实现这将需要一个IOT开发平台,允许个人快速,轻松地体现他们的想法并创建IoT原型。该平台还应支持可以自定义的小型较低电源IOT传感器节点的开发,以处理各种功能和应用程序。东芝和东京大学目前评估了万亿节点发动机作为开放式IOT平台,并发现它在易用性方面提供了优势。克服的显着挑战是IOT节点的进一步小型化,特别是它们的连接器,这相对较大,需要精确焊接专业。如果IOT系统连接印刷电路板(PCB)和电机,则在PCB和电机之间需要线束。线束和PCB之间的连接将导致终端块8mm高,这对于物联网平台而言太大。

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    《Asia electronics industry》 |2021年第8期|36-36|共1页
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