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首页> 外文期刊>Applied Surface Science >Interplay between grain boundary diffusion and annealing temperature on the conductivity of NiO coated Samarium doped ceria
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Interplay between grain boundary diffusion and annealing temperature on the conductivity of NiO coated Samarium doped ceria

机译:晶界扩散和退火温度对NiO包覆的do掺杂二氧化铈电导率的相互作用

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Elemental diffusion in ceramics can modulate the conductivity as well as fuel cell performance. Here, we report the effect of diffusion on NiO coated samarium doped ceria (SDC) with temperature and correlated with conductivity. NiO thin film was deposited using electron beam physical vapor deposition over the pre-sintered SDC substrate and subsequently treated at 800 degrees C, 1000 degrees C, and 1200 degrees C. Depth profiling analysis across NiO-SDC hetero-interface using FESEM-EDAX revealed that the width of the diffusion zone increased with temperature. All the constituent ions like Ni, Sm and Ce diffuse mutually without forming any impurity phases at the NiO-SDC interface. The estimated diffusivity values demonstrated that the nickel predominantly diffuses through the grain boundary of SDC. The constituent cations were found to diffuse several hundred nanometers through grain boundaries at a temperature of 1200 degrees C. An increase in the electrical conductivity was observed in proportion to the width of the diffusion layer. The diffusion of nickel predominantly along the grain boundary reduced the grain boundary resistance by altering the space charge potential at the NiO-SDC interface. Our study demonstrates that the modification of grain boundary through the controlled diffusion of metal ions reduce the resistance for oxygen ion transport in NiO-SDC electrolyte.
机译:陶瓷中的元素扩散可以调节电导率以及燃料电池的性能。在这里,我们报告了扩散对NiO涂层sa掺杂二氧化铈(SDC)随温度的影响,并与电导率相关。使用电子束物理气相沉积法在预烧结的SDC基板上沉积NiO薄膜,然后在800摄氏度,1000摄氏度和1200摄氏度下对其进行处理。使用FESEM-EDAX分析了NiO-SDC异质界面的深度分布分析扩散区的宽度随温度增加。 Ni,Sm和Ce等所有组成离子相互扩散,而在NiO-SDC界面上不形成任何杂质相。估计的扩散率值表明,镍主要通过SDC的晶界扩散。发现组成阳离子在1200℃的温度下通过晶界扩散数百纳米。观察到电导率与扩散层的宽度成比例地增加。镍主要沿晶界扩散,通过改变NiO-SDC界面处的空间电荷电位,降低了晶界电阻。我们的研究表明,通过控制金属离子的扩散来改变晶界可以降低NiO-SDC电解质中氧离子迁移的阻力。

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