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Chemical etching mechanisms and crater morphologies pre-irradiated by temporally decreasing pulse trains of femtosecond laser

机译:飞秒激光的脉冲序列随时间减少而预辐照的化学蚀刻机理和陨石坑形态

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摘要

We report the influence of temporally decreasing pulse trains on femtosecond laser-induced chemical etching (FLICE) of fused silica. A systematic comparison of the unshaped pulse and decreasing pulse trains of femtosecond laser for FLICE was conducted, and the differences were interpreted using a plasma model. The results revealed that the decreasing pulse trains not only affected the etching efficiency but also affected the morphology of the etched crater. When an etched crater was pre-irradiated by decreasing pulse trains, it presented a funnel-like shape at the early stage of the etching process, which contrasted with the one pre-irradiated by unshaped pulse. At the later stage of the etching process, the funnel-like shape gradually disappeared, and the crater increased in size. Compared with the unshaped pulse under the same processing conditions, the decreasing pulse trains enhanced the etched crater volume by approximately 18 times. Theoretical calculations based on the plasma model indicated that the free-electron density generated using the unshaped pulse was much higher than that generated by the decreasing pulse trains in skin layer of the sample during the first few hundred femtoseconds. The high free-electron density increased the reflectivity in skin layer of the sample; thus, the tail part of the incident pulse was strongly reflected. Consequently, the laser energy deposition into the fused silica sample decreased, eventually led to a low etching efficiency.
机译:我们报告了暂时减少的脉冲序列对飞秒激光诱导的熔融石英化学蚀刻(FLICE)的影响。系统地比较了飞秒激光对FLICE的不整形脉冲序列和递减脉冲序列,并使用等离子模型解释了差异。结果表明,减少的脉冲序列不仅影响刻蚀效率,而且影响刻蚀坑的形貌。当通过减少脉冲序列对被蚀刻的陨石坑进行预辐照时,它在蚀刻过程的早期呈现出漏斗状的形状,这与未成形的脉冲被预先辐照的形状相反。在蚀刻过程的后期,漏斗状的形状逐渐消失,并且凹坑的尺寸增大。与相同加工条件下的未整形脉冲相比,减少的脉冲序列将蚀刻后的弹坑体积提高了约18倍。基于等离子体模型的理论计算表明,在最初的几百飞秒内,使用未整形脉冲产生的自由电子密度远高于通过减少样品表皮层中脉冲序列产生的自由电子密度。高的自由电子密度提高了样品表皮层的反射率;因此,入射脉冲的尾部被强烈反射。结果,激光能量沉积到熔融二氧化硅样品中的量减少,最终导致低蚀刻效率。

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