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Proposal of a multi-layer channel MOSFET: the application of selective etching for Si/SiGe stacked layers

机译:多层沟道MOSFET的建议:选择性蚀刻在Si / SiGe堆叠层中的应用

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摘要

A multi-layer channel MOSFET (ML-MOSFET) and its fabrication process were proposed for future CMOS application. ML-MOSFET has multi-Si channel layers stacked vertically, so that the drain current per 1 mum gate width on wafer is expected to increase with the number of channel layers compared to conventional double-gate MOSFET. I-on = 3.9 mA/mum was obtained for ML-MOSFET with three Si channel layers (L-g: 10 mn, T-Si: 2.5 nm) by the device simulation. Fabrication process of multilayer channel using selective etching for SiGe/Si stacked layers was also investigated. (C) 2003 Published by Elsevier B.V. [References: 6]
机译:提出了一种多层沟道MOSFET(ML-MOSFET)及其制造工艺,以用于未来的CMOS应用。 ML-MOSFET具有垂直堆叠的多硅沟道层,因此,与传统的双栅MOSFET相比,晶圆上每1毫米栅极宽度的漏极电流预计会随着沟道层的数量而增加。通过器件仿真,具有三个硅沟道层(L-g:10百万,T-Si:2.5 nm)的ML-MOSFET的I-on = 3.9 mA / mum。还研究了选择性刻蚀SiGe / Si叠层的多层沟道的制备工艺。 (C)2003年由Elsevier B.V.出版[参考文献:6]

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