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Nano-deformation of a Ni-P coating surface after nanoparticle impacts

机译:纳米粒子撞击后Ni-P涂层表面的纳米变形

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Chemical mechanical polishing (CMP) has become a primary planarization technique required for the manufacture of a computer hard disk substrate. In CMP, erosive wear, which is regarded as one of the wear mechanisms underlying the interaction between the abrasive particles and polished surfaces, can occur when materials are removed by the surface collision of particles which are carried by a fluid medium. A fundamental understanding of the process in which nanoparticles impact on the surface of the nickel-phosphorous (Ni-P) coating plated on the computer hard disk substrate is important to the control and preventing of surface defects during CMR In this study, a cylindrical liquid jet containing de-ionized water and SiO2 nanoparticles impacts obliquely on the surface of Ni-P coating at a speed of 10 m/s. Microscopic examinations of the impacted surface are performed using a high resolution transmission electron microscope, an atomic force microscope, etc. Experimental results indicate that craters and scratches in the surface have taken place after nanoparticle impacts, and crystal grains in nano-scale and an element phosphorus concentration can be found in the sub-surface layer of the impacted surface. (c) 2005 Elsevier B.V. All rights reserved.
机译:化学机械抛光(CMP)已成为制造计算机硬盘基板所需的主要平面化技术。在CMP中,当通过流体介质携带的颗粒的表面碰撞而去除材料时,会发生侵蚀磨损,这是磨料颗粒与抛光表面之间相互作用的基础之一。对纳米颗粒撞击镀覆在计算机硬盘基板上的镍-磷(Ni-P)涂层表面的过程的基本理解,对于控制和防止CMR过程中的表面缺陷非常重要。含有去离子水和SiO2纳米颗粒的喷射流以10 m / s的速度倾斜冲击Ni-P涂层的表面。使用高分辨率透射电子显微镜,原子力显微镜等对受冲击表面进行了显微镜检查。实验结果表明,纳米颗粒撞击后,在表面产生了凹坑和划痕,纳米级晶粒和元素磷浓度可在受冲击表面的次表层发现。 (c)2005 Elsevier B.V.保留所有权利。

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