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Investigation Of The 4h-sic Surface

机译:4h-sic表面的研究

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The silicon carbide (SiC) surface is more complex than that of silicon and can be carbon-terminated or silicon-terminated, and can exist as several reconstructions. Investigations of the surface structure as a function of temperature, under ultrahigh vacuum (UHV) conditions using scanning tunneling microscopy (STM) and low energy electron diffraction (LEED), are presented. The 4H-SiC surface can be passivated using a silicon deposition/evaporation technique to reconstruct the surface. This has a significant effect on the electrical behaviour of metal contacts to the silicon carbide surface, critical in any electronic device. Atomic resolution STM studies of the 4H-SiC surface have revealed step features and micropipe defects in unprecedented detail. STM has also been used to image clusters of metal deposited on the 4H-SiC surface. The effect of annealing on the behaviour of these nickel clusters is also presented. The surface of the silicon carbide is extremely important in the fabrication of silicon carbide electronic devices and this paper presents a discussion of the SiC surface with particular reference to its impact on SiC device applications in power electronics.
机译:碳化硅(SiC)表面比硅表面复杂,可以被碳封端或被硅封端,并且可以作为几种重构形式存在。提出了使用扫描隧道显微镜(STM)和低能电子衍射(LEED)在超高真空(UHV)条件下研究表面结构随温度变化的函数。可以使用硅沉积/蒸发技术对4H-SiC表面进行钝化以重建表面。这对与碳化硅表面的金属触点的电行为具有重大影响,这在任何电子设备中都至关重要。原子分辨率STM对4H-SiC表面的研究已揭示了台阶特征和微管缺陷,其细节前所未有。 STM也已用于成像沉积在4H-SiC表面的金属簇。还介绍了退火对这些镍团簇行为的影响。碳化硅的表面在制造碳化硅电子器件中非常重要,本文介绍了SiC表面,特别是其对功率电子器件中SiC器件应用的影响。

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