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机译:温度梯度下Cu / Au薄膜的分子动力学模拟
Chongqing Univ, Coll Aerosp Engn, Chongqing 400030, Peoples R China|Chongqing Univ, State Key Lab Coal Mine Disaster Dynam & Control, Chongqing 400030, Peoples R China|Chongqing Univ, Chongqing Key Lab Heterogeneous Mat Mech, Chongqing 400030, Peoples R China;
Chongqing Univ, Coll Aerosp Engn, Chongqing 400030, Peoples R China|Chongqing Univ, State Key Lab Coal Mine Disaster Dynam & Control, Chongqing 400030, Peoples R China;
Chongqing Univ, State Key Lab Coal Mine Disaster Dynam & Control, Chongqing 400030, Peoples R China;
Chongqing Univ, Coll Aerosp Engn, Chongqing 400030, Peoples R China;
Chongqing Univ, Coll Aerosp Engn, Chongqing 400030, Peoples R China|Chongqing Univ, Chongqing Key Lab Heterogeneous Mat Mech, Chongqing 400030, Peoples R China;
Chongqing Univ, Coll Aerosp Engn, Chongqing 400030, Peoples R China;
Thin film; Cu/Au; Temperature gradient; Mean square displacement; Molecular dynamics simulation;
机译:不同温度下Cu / Au薄膜纳米凸缘的分子动力学模拟
机译:分子动力学模拟Cu-Zr-Al金属玻璃薄膜在高温下的压痕性能
机译:纳米茚基Cu和Au的Ni薄膜的分子动力学模拟
机译:分子动力学研究Au / Cu / Au / Cu纳米薄膜的温度和单轴拉伸速度的影响
机译:薄膜界面和快速凝固的分子动力学模拟。
机译:使用球形压头在Cu / Ni纳米孪晶多层膜上纳米压痕的分子动力学模拟
机译:来自分子动力学模拟的薄铜膜中的位错形核:通过热涨落引起的不稳定性