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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Electrical degradation of a high-T/sub c/ superconductor by continuous current transport
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Electrical degradation of a high-T/sub c/ superconductor by continuous current transport

机译:高T / sub c /超导体通过连续电流传输的电降解

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摘要

Several companies in the world are marketing superconducting products, such as wires, films, and bulk, and so on. High-T/sub c/ superconducting (HTS) systems have begun to be commercialized with these HTS products, and the demand for them is increasing. A database on the electrical degradation of high-T/sub c/ superconductors is an essential requirement to commercialize HTS systems. The electrical degradation of Bi-2223 wire has been investigated in this paper. To simulate the conditions of real systems, two types of specimens were prepared. One was named Ring Specimen with Bi-2223 wire on a bobbin of 400 mm diameter and the other was named Double-Pancake Specimen with Bi-2223 wire coiled on a bobbin of 100 mm diameter. The Bi-2223 wire of the Double -Pancake Specimen was coiled with several winding tensions. The continuous current transport method was used for the measurement of the electrical degradation. Various levels of transport current were applied to each conductor. The levels are 90, 95, 98, and 110% of the critical current (I/sub c/) in Ring Specimens and 95 and 150% in Double-Pancake Specimens. Although a difference of the I/sub c/ in the long Bi-2223 wire was found, there was not any severe degradation in the Ring Specimens. When the level of transport current was below the critical current, degradation did not appear in the Double-Pancake Specimens either. However, they degraded very quickly when the level of transport current was 150% of I/sub c/.
机译:世界上有几家公司正在销售超导产品,例如电线,薄膜和散装等。这些高超导体产品已经开始商业化高T / sub c /超导(HTS)系统,并且对它们的需求正在增加。有关高T / sub c /超导体电降解的数据库是商业化HTS系统的基本要求。本文研究了Bi-2223导线的电降解。为了模拟实际系统的条件,准备了两种类型的标本。一个被称为环形标本,在直径为400 mm的线轴上带有Bi-2223线,另一个被称为双煎饼式标本,其被卷绕在直径为100 mm的线轴上的Bi-2223线。双煎饼样品的Bi-2223线材以几种缠绕张力缠绕。连续电流传输法用于电性能的测量。不同水平的传输电流被施加到每个导体。在环形样品中,该水平为临界电流(I / sub c /)的90%,95%,98%;在双煎饼样品中,其水平为临界电流(I / sub c /)的95%和150%。尽管在较长的Bi-2223导线中发现了I / sub c /的差异,但是在环形试样中没有任何严重的劣化。当传输电流的水平低于临界电流时,双煎饼样品也不会出现降解。但是,当传输电流为I / sub c /的150%时,它们很快退化。

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