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Measurement of Electromechanical Property in Thick-Film EDDC-SmBCO Coated Conductors With High Critical Current

机译:高临界电流厚膜EDDC-SmBCO涂层导体中机电性能的测量

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摘要

In this paper, in order to ensure its performance in practical applications, the mechanical and electromechanical properties of thick-film evaporation-in-dual chamber (EDDC)-SmBCO coated conductor (CC) tapes with high critical current have been investigated. The effect of CC tape architecture and film thickness on critical current $I_{c}$ in EDDC-SmBCO CC tapes with thick film under uniaxial tension and bending deformation was measured and compared with the Cu-stabilized sample. By adopting a bridge pattern and by applying a magnetic field and some measures, the electromechanical property of thick-film CC tapes with high $I_{c}$ could be evaluated, suppressing the burnout during deformation. As a result, increasing the SmBCO film thickness affects the irreversible strain limit and $I_{c}$ degradation behaviors. In the case of a 5- $muhbox{m}$-thick film, an acceptable bending strain tolerance 0.34% was measured and the uniaxial irreversible strain limit of 0.28% can be still improved by an additional Cu stabilizer.
机译:在本文中,为了确保其在实际应用中的性能,已研究了具有高临界电流的厚膜双腔室蒸发(EDDC)-SmBCO涂层导体(CC)胶带的机械和机电性能。测量了CC胶带结构和膜厚对EDDC-SmBCO EDDC-SmBCO CC厚胶带在单轴张力和弯曲变形下的临界电流$ I_ {c} $的影响,并与铜稳定的样品进行了比较。通过采用桥形图案并施加磁场和一些措施,可以评估具有高$ I_ {c} $的厚膜CC胶带的机电性能,从而抑制变形期间的烧毁。结果,增加SmBCO膜厚度会影响不可逆应变极限和$ I_ {c} $降解行为。在厚度为5微米的薄膜的情况下,测得的可接受的弯曲应变容差为0.34%,而额外的Cu稳定剂仍可改善单轴不可逆应变极限0.28%。

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