首页> 外文期刊>Applied Physics >Runaway lattice-mismatched interface in an atomistic simulation of femtosecond laser irradiation of Ag film-Cu substrate system
【24h】

Runaway lattice-mismatched interface in an atomistic simulation of femtosecond laser irradiation of Ag film-Cu substrate system

机译:飞秒激光辐照Ag膜-Cu衬底系统的原子模拟失控晶格失配界面

获取原文
获取原文并翻译 | 示例
           

摘要

The atomic mixing and structural transformations in a Ag film-Cu substrate system irradiated by a femtosecond laser pulse are investigated in a simulation performed with a model that couples the classical molecular dynamics method with a continuum-level description of the laser excitation and subsequent relaxation of the conduction-band electrons. The higher strength of the electron-phonon coupling in Cu compared to Ag results in preferential subsurface heating and melting of the Cu substrate. The melting is followed by fast cooling and rapid resolidification occurring under conditions of strong undercooling below the equilibrium melting temperatures of Cu and Ag. The rapid resolidification results in a complex structure of the interfacial region, where the lattice-mismatched interface is separated from the Ag-Cu mixing region by an intermediate pseudo-morphic bcc Cu layer that grows epitaxially on the (001) face of the fcc Ag film during the final stage of the resolidification process. The new lattice-mismatched interface has a three-dimensional structure consisting of a periodic array of stacking fault pyramids outlined by stair-rod partial dislocations. The intermediate bcc layer and the stacking fault pyramid structure of the mismatched interface are likely to present a strong barrier for dislocation propagation, resulting in the effective hardening of the layered structure treated by the laser irradiation. The concentration profiles in the atomic mixing region are substantially wider compared to the width of the equilibrium Cu-Ag interface and have a pronounced asymmetric shape that reflects the preferential melting of the Cu substrate.
机译:用模型将经典分子动力学方法与激光激发的连续水平描述以及随后的弛豫耦合在一起的模型进行了模拟,研究了飞秒激光脉冲照射的Ag膜-Cu基底系统中的原子混合和结构转变。导带电子。与Ag相比,Cu中电子-声子耦合的更高强度导致优先的地下加热和Cu基体的熔化。熔融之后,在低于铜和银的平衡熔融温度的强烈过冷条件下,发生快速冷却和快速再凝固。快速再凝固导致界面区域的复杂结构,其中晶格不匹配的界面通过中间的伪晶状bcc Cu层与Ag-Cu混合区分开,该中间层在fcc Ag的(001)面上外延生长电影在重组过程的最后阶段。新的晶格不匹配界面具有三维结构,该三维结构由周期性堆积的断层金字塔组成,这些断层金字塔由阶梯杆部分位错勾勒出轮廓。错配界面的中间bcc层和堆积断层金字塔结构可能会为位错传播提供强大的屏障,从而导致通过激光辐照处理的层状结构有效硬化。与平衡的Cu-Ag界面的宽度相比,原子混合区域中的浓度分布要宽得多,并且具有明显的不对称形状,反映了Cu基体的优先熔化。

著录项

  • 来源
    《Applied Physics》 |2011年第3期|p.781-792|共12页
  • 作者单位

    Department of Materials Science and Engineering,University of Virginia, 395 McCormick Road, Charlottesville,VA 22904-4745, USA;

    Faculty of Engineering, University of Tokyo, Tokyo, Japan;

    Department of Physics, Renewable Energy Materials Research Science and Engineering Center (REMRSEC), Colorado School of Mines, Golden, CO, USA;

    Department of Materials Science and Engineering,University of Virginia, 395 McCormick Road, Charlottesville,VA 22904-4745, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号