Electrically conducting film of silver sub-micron particles as mechanical and electrical interfaces for transfer printed micro- and nano-pillar devices

摘要

In this paper we report a novel application of electrically conductive film (ECF) of Ag sub-micron particles that includes both isotropic and anisotropic film technologies in providing simultaneous electrical contact and mechanical anchor between fracture transfer-printed (1-D) single crystal semiconductor micro- and nano-pillars and a carrier substrate. We assembled silver sub-micron particles (AgSP) monolayers with varying particle diameters and investigated their optical and electrical characteristics prior to their incorporation into thermoplastic polymers. It was found that transfer-printing of the Si micropillar arrays, into electrically conductive thermoplastic receiver substrates, made of films of AgSP/PMMA blends atop metallic substrates could be effectively achieved to yield electrically interfaced 1-D Si micropillar arrays with retention of their orientation and integrity according to the SEM images. The carrier substrate can potentially be reused to generate additional Si micropillar arrays that can be similarly harvested.