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Improved interfacial and electrical properties of GaAs metal-oxide-semiconductor capacitors with HfTiON as gate dielectric and TaON as passivation interlayer

机译:以HfTiON为栅介电层和TaON为钝化中间层的GaAs金属氧化物半导体电容器的界面和电学性能得到改善

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摘要

The interfacial and electrical properties of sputtered HfTiON on sulfur-passivated GaAs with or without TaON as interfacial passivation layer (IPL) are investigated. Experimental results show that the GaAs metal-oxide-semiconductor capacitor with HfTiON/TaON stacked gate dielectric annealed at 600 °C exhibits low interface-state density (1.0 × 1012 cm-2 eV-1), small gate leakage current (7.3 × 10-5 A cm-2 at Vg = Vfb + 1 V), small capacitance equivalent thickness (1.65 nm), and large equivalent dielectric constant (26.2). The involved mechanisms lie in the fact that the TaON IPL can effectively block the diffusions of Hf, Ti, and O towards GaAs surface and suppress the formation of interfacial As-As bonds, Ga-/As-oxides, thus unpinning the Femi level at the TaON/GaAs interface and improving the interface quality and electrical properties of the device.
机译:研究了在有或没有TaON作为界面钝化层(IPL)的硫钝化GaAs上溅射HfTiON的界面和电学性能。实验结果表明,在600 C下退火的HfTiON / TaON堆叠栅介质的GaAs金属氧化物半导体电容器的界面态密度低(1.0×10 12 cm -2 eV -1 ),栅极漏电流小(在V g时为7.3×10 -5 A cm -2 = V fb + 1 V),小电容等效厚度(1.65 nm),大等效介电常数(26.2)。所涉及的机理在于,TaON IPL可以有效地阻止Hf,Ti和O向GaAs表面的扩散,并抑制界面As-As键,Ga- / As-氧化物的形成,从而在TaON / GaAs接口,并改善了设备的接口质量和电性能。

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  • 来源
    《Applied Physics Letters》 |2013年第9期|1-4|共4页
  • 作者

    Wang; L.S.; Xu; J.P.; Zhu; S.Y.; Huang; Y.;

  • 作者单位

    School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, People's Republic of China|c|;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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