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Surface plasmon coupled light-emitting diode with metal protrusions into p-GaN

机译:具有金属突起的表面等离子体激元耦合的发光二极管成p-GaN

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摘要

An Ag protrusion array is fabricated on the p-GaN layer of an InGaN/GaN quantum-well (QW) light-emitting diode (LED) for generating surface plasmon coupling with the radiating dipoles in the QWs and hence LED emission enhancement. The tips of the Ag protrusions penetrating into the p-GaN layer are close to the QWs such that the induced near field around the tips can strongly interact with the dipoles in the QWs. With the Ag protrusions, the fabricated flip-chip LED shows a 74.6% enhancement in output intensity at 100 mA in injection current, when compared with a control sample of no Ag protrusion. The simulation results of Ag protrusion absorption agree reasonably well with the experimental data of protrusion reflectance. The simulation also shows a strong near field distribution around the tip of an Ag protrusion for coupling with the radiating dipoles in the QWs.
机译:在InGaN / GaN量子阱(QW)发光二极管(LED)的p-GaN层上制造Ag突起阵列,以产生与QW中的辐射偶极耦合的表面等离子体激元,从而增强LED的发射。穿透到p-GaN层中的Ag突起的尖端靠近QW,因此尖端周围的感应近场可以与QW中的偶极子强烈相互作用。与没有Ag突起的对照样品相比,具有Ag突起的制造的倒装芯片LED在注入电流为100µmA时,输出强度提高了74.6%。 Ag突起吸收的模拟结果与突起反射率的实验数据吻合得很好。该模拟还显示出在Ag突起的尖端周围有很强的近场分布,用于与QW中的辐射偶极子耦合。

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