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Room-temperature deep-ultraviolet lasing at 241.5 nm of AlGaN multiple-quantum-well laser

机译:AlGaN多量子阱激光器在241.5 nm处的室温深紫外激光发射

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摘要

Room-temperature deep-ultraviolet lasing of Al_(x)Ga_(1-x)N multiple-quantum-well lasers with an Al composition x of 0.66 was achieved at 241.5 nm under pulsed optical pumping. The threshold pumping power was approximately 1200 kW/cm~(2) at room temperature. The shortest lasing wavelength was 231.8 nm at 20 K. The laser structure was grown on a high-quality AlN layer, which was grown on a 4H-SiC substrate by inserting an AlN/GaN multibuffer-layer structure between the substrate and the AlN layer. Temperature dependence of lasing wavelength was also estimated to be 0.01 and 0.03 nm/K in the temperature region from 20 to 150 K and from 160 K to room temperature, respectively. The laser cavity was made of a cleaved facet of AlGaN epitaxial layers and a SiC substrate. For this purpose, it was necessary to polish the wafer to a thickness of less than 100 μm. The optimal wafer thickness for cleaving in our experiments was 60-70 μm.
机译:在脉冲光泵浦下,在241.5 nm处实现了Al成分x为0.66的Al_(x)Ga_(1-x)N多量子阱激光器的室温深紫外激光发射。在室温下,阈值泵浦功率约为1200 kW / cm〜(2)。最短的激光波长为201.8 K时的231.8 nm。激光结构生长在高质量的AlN层上,通过在衬底和AlN层之间插入AlN / GaN多层缓冲层结构在4H-SiC衬底上生长。在20至150 K和160 K至室温的温度范围内,激光波长的温度依赖性也分别估计为0.01和0.03 nm / K。激光腔由AlGaN外延层和SiC衬底的劈开面组成。为此目的,必须将晶片抛光至小于100μm的厚度。在我们的实验中,用于切割的最佳晶圆厚度为60-70μm。

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