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Conformal thin-film silicon nitride deposited by hot-wire chemical vapor deposition

机译:通过热线化学气相沉积沉积的共形薄膜氮化硅

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摘要

We have studied silicon nitride thin films deposited by hot-wire chemical vapor deposition as a function of the substrate temperature and hydrogen dilution. We found that adding H_2 to the process significantly enhances silicon nitride film deposition. High-quality films can be grown at low substrate temperatures ( < 350 ℃). At optimized conditions, a 500-A-thick silicon nitride film gives a nearly 100% surface coverage on a 100 nm scale object. H dilution dramatically increases the NH_2 radicals in the process and leads to conformal films.
机译:我们已经研究了通过热线化学气相沉积法沉积的氮化硅薄膜与衬底温度和氢稀释度之间的关系。我们发现向该工艺中添加H_2可以显着增强氮化硅膜的沉积。高质量的薄膜可以在较低的基板温度(<350℃)下生长。在最佳条件下,厚度为500A的氮化硅膜可在100 nm规模的物体上提供近100%的表面覆盖率。 H稀释会大大增加该过程中的NH_2自由基,并形成保形膜。

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