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Stability of fully deuterated amorphous silicon thin-film transistors

机译:完全氘化的非晶硅薄膜晶体管的稳定性

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The threshold voltage stability of fully deuterated (a-Si: D) and hydrogenated amorphous silicon (a-Si:H) thin-film transistors (TFTs) is compared. The difference in the kinetic energy of D~+ and H~+ ions upon impact with the growing surface during radio-frequency plasma-enhanced chemical vapor deposition leads to material having different physical properties for the same nominal deposition conditions. However, a-Si:D and a-Si:H grown at the same growth rate by adjusting the gas pressure have almost identical properties. By using the growth rate as a normalizing parameter for comparing a-Si:H and a-Si:D TFTs, it is shown that there is no difference in the stability of a-Si:D compared with a-Si:H TFTs. This study rules out the possibility of a giant isotopic effect in amorphous silicon TFTs, and supports the model for Si dangling bond defect creation in a-Si: H where the breaking of weak Si-Si bonds is the rate-limiting step.
机译:比较了完全氘化(a-Si:D)和氢化非晶硅(a-Si:H)薄膜晶体管(TFT)的阈值电压稳定性。在射频等离子体增强化学气相沉积过程中,随着生长表面的撞击,D〜+和H〜+离子的动能差异导致材料在相同的标称沉积条件下具有不同的物理性质。但是,通过调节气压以相同的生长速度生长的a-Si:D和a-Si:H具有几乎相同的特性。通过将生长速率用作比较a-Si:H和a-Si:D TFT的归一化参数,表明与a-Si:H TFT相比,a-Si:D的稳定性没有差异。这项研究排除了在非晶硅TFT中产生巨大同位素效应的可能性,并支持在a-Si:H中形成Si悬空键缺陷的模型,其中弱Si-Si键的断裂是限速步骤。

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