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Enhancing memory efficiency of Si nanocrystal floating gate memories with high-κ gate oxides

机译:使用高κ栅极氧化物提高Si纳米晶体浮栅存储器的存储效率

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摘要

High-performance floating gate memory devices of Si nanocrystal (NC) dots on HfO_2 gate oxide were fabricated at temperatures below 400 ℃. A large counterclockwise hysteresis of 5.2 V, at an applied voltage of +6 V, and a stored charge density of 6 X 10~(12) cm~(-2) were observed. Moreover, the smaller band offset of the high-κ tunneling layer resulted in higher charge tunneling probabilities towards the Si NC dots than those observed with a SiO_2 tunneling layer. Advantages in terms of scaling for a high-performance and stable reliability memory device are confirmed.
机译:在低于400℃的温度下,制造了HfO_2栅氧化物上的Si纳米晶(NC)点的高性能浮栅存储器件。在施加的电压为+6 V的情况下,观察到较大的逆时针磁滞为5.2 V,并且存储的电荷密度为6 X 10〜(12)cm〜(-2)。此外,与使用SiO_2隧穿层观察到的情况相比,高κ隧穿层的带隙更小导致朝向Si NC点的电荷隧穿概率更高。确认了在高性能和稳定可靠性存储装置的缩放方面的优势。

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