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Heating and cooling in semiconductor structures by an electric current

机译:电流对半导体结构的加热和冷却

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摘要

A comprehensive study of the mechanisms of heating and cooling originated by an electrical current in semiconductor devices is reported. The authors studied the Peltier, Joule, and Thomson phenomena self-consistently and found that the magnitudes of all of them were commensurable. A new formulation and interpretation of the Thomson effect are offered. The main conclusion of the present work is that the thermal analysis of any semiconductor device under real working conditions demands the inclusion of all heating and cooling mechanisms simultaneously.
机译:报告了对由半导体器件中的电流引起的加热和冷却机理的全面研究。作者对珀尔帖,焦耳和汤姆森现象进行了自洽的研究,发现它们的大小都是可以相称的。提供了汤姆森效应的新公式和解释。本工作的主要结论是,在实际工作条件下对任何半导体器件进行热分析都需要同时包括所有加热和冷却机制。

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