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Temperature dependence of the surface plasmon coupling with an InGaN/GaN quantum well

机译:与InGaN / GaN量子阱耦合的表面等离子体激元的温度依赖性

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The authors demonstrate the temperature-dependent behavior of the surface plasmon (SP) coupling with two InGaN/GaN quantum-well (QW) structures of different internal quantum efficiencies. The SP modes are generated at the interface between the QW structures and Ag thin films coated on their tops. It is observed that the SP-QW coupling rate increases with temperature. Such a trend may rely on several factors, including the availability of carriers with sufficient momenta for transferring the energy and momentum into the SP modes and possibly the variation of the SP density of state with temperature. Although the required momentum matching condition only needs the thermal energy corresponding to a few tens of Kelvins, the carrier delocalization process results in a significantly higher probability of SP-carrier momentum matching and hence SP-QW coupling.
机译:作者展示了表面等离子体激元(SP)与具有不同内部量子效率的两个InGaN / GaN量子阱(QW)结构耦合的温度依赖性行为。 SP模式在QW结构和顶部覆盖的Ag薄膜之间的界面处生成。可以看出,SP-QW耦合速率随温度增加。这种趋势可能取决于几个因素,包括具有足够动量的载流子的可用性,以将能量和动量转换为SP模式,以及SP态密度随温度的变化。尽管所需的动量匹配条件仅需要对应于几十个开尔文的热能,但载流子离域过程导致SP-载流子动量匹配以及SP-QW耦合的可能性大大提高。

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