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Interstitial-based boron diffusion dynamics in amorphous silicon

机译:非晶硅中基于间隙的硼扩散动力学

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Using density-functional theory calculations we identified an interstitial-based fast boron diffusion mechanism in amorphous silicon. We found that interstitial-like point defects, omnipresent in as-implanted silicon, to be very stable in an amorphous network and can form highly mobile pair with Boron atoms. The transient existence of such point defects in amorphous silicon- is suggested to play an important role in boron diffusion. We found the activation energy for this pathway to be 2.73 eV, in good agreement with experimental results. In addition, this mechanism is consistent with the experimentally reported transient and concentration-dependent features of boron diffusion in amorphous silicon.
机译:使用密度泛函理论计算,我们确定了非晶硅中基于间隙的快速硼扩散机制。我们发现,类似缝隙的点缺陷在注入的硅中普遍存在,在非晶网络中非常稳定,并且可以与硼原子形成高度可移动的对。建议在非晶硅中暂时存在此类点缺陷,这在硼扩散中起重要作用。我们发现该途径的活化能为2.73 eV,与实验结果高度吻合。另外,该机理与实验报道的非晶硅中硼扩散的瞬态和浓度依赖性特征一致。

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