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Effects Of Reoxidation On Band Alignment In N-incorporated Sion Films As A Function Of Sequential Thermal Annealing In No And Nh_3

机译:再氧化对掺入N的Sion薄膜中能带取向的影响与No和Nh_3中顺序热退火的关系

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摘要

The effects of reoxidation on the band structure of N-incorporated SiON films were investigated as a function of thermal treatment in NO and NH_3. Reoxidation-associated changes in band gap and valence band offset of the N-incorporated SiON films prepared by sequential thermal annealing in both NO and NH_3 were less than those observed for the nitrided film prepared by thermal annealing in only NH_3. The differences in band-alignment characteristics of the nitrided films that resulted from use of different nitridation methods were strongly related to the depth distribution of N and the chemical states of N bonded to Si.
机译:研究了在NO和NH_3中,再氧化对掺入N的SiON薄膜的能带结构的影响与热处理的关系。通过在NO和NH_3中依次进行热退火而制备的掺入N的SiON膜,与带隙和价带偏移的重新氧化相关的变化要小于仅在NH_3中通过热退火而制备的氮化膜所观察到的变化。由于使用不同的氮化方法而导致的氮化膜的能带取向特性差异与N的深度分布和与Si结合的N的化学态密切相关。

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