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Evaluation of vortex pinning across low angle grain boundary in YBa_2Cu_3O_7 film

机译:YBa_2Cu_3O_7薄膜中低角度晶界的涡旋钉扎评估

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摘要

Vortex pinning potential across a 5° tilt low angle grain boundary (GB) was evaluated by measuring angular dependences of critical current density in a bicrystal YBa_2Cu_3O_7 film under the variable Lorentz force configuration. Trapping angles of the GB depend on directions in the GB plane (70°-80° and 15°-45° for the c-axis direction and the ab plane one, respectively), due to anisotropic pinning of GB dislocations. Pinning potential across a GB is as large as that of heavy ion irradiated columnar defects, indicating that density and distribution of GBs should be controlled to improve vortex pinning in coated conductors.
机译:通过在可变洛伦兹力配置下测量双晶YBa_2Cu_3O_7膜中临界电流密度的角度依赖性,评估了跨5°倾斜低角度晶界(GB)的涡旋钉扎电势。由于GB位错的各向异性钉扎,GB的夹角取决于GB平面中的方向(对于c轴方向和ab平面分别为70°-80°和15°-45°)。 GB的钉扎电位与重离子辐照的柱状缺陷的钉扎电位一样大,这表明应控制GBs的密度和分布,以改善涂层导体中的涡旋钉扎。

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  • 来源
    《Applied Physics Letters》 |2012年第11期|p.112604.1-112604.4|共4页
  • 作者单位

    Department Materials Science and Engineering, Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku,Kitakyushu 804-8550, Japan;

    Department Materials Science and Engineering, Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku,Kitakyushu 804-8550, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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  • 入库时间 2022-08-18 03:17:34

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