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The structure measurement of micro-electro-mechanical system devices by the optical feedback tomography technology

机译:利用光反馈层析成像技术测量微机电系统器件的结构

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摘要

We describe a potential way to obtain the images of the surface and internal structure of micro-electro-mechanical system devices by optical feedback tomography technology. By using different materials and various structures of micro devices as the samples, this approach is proved to be able to measure the geometric structure of the micro device, including the internal structure, which makes it possible to detect whether the micro-device tested meets its fabrication requirements.
机译:我们描述了一种潜在的方式,通过光学反馈层析成像技术获得微机电系统设备的表面和内部结构的图像。通过使用不同材料和微型设备的各种结构作为样本,该方法被证明能够测量微型设备的几何结构,包括内部结构,从而可以检测所测试的微型设备是否符合其要求。制造要求。

著录项

  • 来源
    《Applied Physics Letters》 |2013年第22期|221902.1-221902.4|共4页
  • 作者单位

    Institute of Opto-Electronic Engineering, Tsinghua University, Beijing 100084, China;

    Institute of Opto-Electronic Engineering, Tsinghua University, Beijing 100084, China;

    Institute of Opto-Electronic Engineering, Tsinghua University, Beijing 100084, China;

    Institute of Opto-Electronic Engineering, Tsinghua University, Beijing 100084, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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