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Self-folding graphene-polymer bilayers

机译:自折叠石墨烯-聚合物双层

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摘要

In order to incorporate the extraordinary intrinsic thermal, electrical, mechanical, and optical properties of graphene with three dimensional (3D) flexible substrates, we introduce a solvent-driven self-folding approach using graphene-polymer bilayers. A polymer (SU-8) film was spin coated atop chemically vapor deposited graphene films on wafer substrates and graphene-polymer bilayers were patterned with or without metal electrodes using photolithography, thin film deposition, and etching. After patterning, the bilayers were released from the substrates and they self-folded to form fully integrated, curved, and folded structures. In contrast to planar graphene sensors on rigid substrates, we assembled curved and folded sensors that are flexible and they feature smaller form factors due to their 3D geometry and large surface areas due to their multiple rolled architectures. We believe that this approach could be used to assemble a range of high performance 3D electronic and optical devices of relevance to sensing, diagnostics, wearables, and energy harvesting.
机译:为了将石墨烯的非凡的固有热,电,机械和光学特性与三维(3D)柔性基材结合在一起,我们引入了一种使用溶剂驱动的自折叠方法,该方法使用石墨烯-聚合物双层。将聚合物(SU-8)膜旋涂在晶片基板上化学气相沉积的石墨烯膜上,并使用光刻,薄膜沉积和蚀刻在有或没有金属电极的情况下对石墨烯-聚合物双层进行构图。图案化后,双层从基材上释放出来,并且它们自折叠以形成完全集成,弯曲和折叠的结构。与刚性基板上的平面石墨烯传感器相比,我们组装了弯曲且折叠的传感器,它们具有柔性,并且由于其3D几何形状而具有较小的外形尺寸,并且由于其多种滚动结构而具有较大的表面积。我们相信,这种方法可用于组装一系列与传感,诊断,可穿戴设备和能量收集相关的高性能3D电子和光学设备。

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  • 来源
    《Applied Physics Letters 》 |2015年第20期| 203108.1-203108.4| 共4页
  • 作者单位

    Institute of Microelectronics, Tsinghua University, Beijing 100084, China,Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA;

    Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA;

    Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA;

    Department of Physics, Johns Hopkins University, Baltimore, Maryland 21218, USA;

    Institute of Microelectronics, Tsinghua University, Beijing 100084, China;

    Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA,Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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