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Capacitance-voltage characteristics of Si and Ge nanomembrane based flexible metal-oxide-semiconductor devices under bending conditions

机译:Si和Ge纳米膜基柔性金属氧化物半导体器件在弯曲条件下的电容电压特性

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摘要

Metal-oxide-semiconductor (MOS) device is the basic building block for field effect transistors (FET). The majority of thin-film transistors (TFTs) are FETs. When MOSFET are mechanically bent, the MOS structure will be inevitably subject to mechanical strain. In this paper, flexible MOS devices using single crystalline Silicon (Si) and Germanium (Ge) nanomembranes (NM) with SiO_2, SiO, and Al_2O_3 dielectric layers are fabricated on a plastic substrate. The relationships between semiconductor nanomembranes and various oxide materials are carefully investigated under ten-sile/compressive strain. The flatband voltage, threshold voltage, and effective charge density in various MOS combinations revealed that Si NM-SiO_2 configuration shows the best interface charge behavior, while Ge NM-Al_2O_3 shows the worst. This investigation of flexible MOS devices can help us understand the impact of charges in the active region of the flexible TFTs and capacitance changes under the tensile/compressive strains on the change in electrical characteristics in flexible NM based TFTs.
机译:金属氧化物半导体(MOS)器件是场效应晶体管(FET)的基本构件。大部分薄膜晶体管(TFT)是FET。当MOSFET机械弯曲时,MOS结构将不可避免地受到机械应变。在本文中,在塑料衬底上制造了使用单晶硅(Si)和锗(Ge)纳米膜(NM)以及SiO_2,SiO和Al_2O_3介电层的柔性MOS器件。在十应变/压缩应变下,仔细研究了半导体纳米膜与各种氧化物材料之间的关系。各种MOS组合的平带电压,阈值电压和有效电荷密度表明,Si NM-SiO_2配置显示出最佳的界面电荷行为,而Ge NM-Al_2O_3显示出最差的界面电荷行为。对柔性MOS器件的研究可以帮助我们了解柔性TFT的有源区域中的电荷以及在拉伸/压缩应变下的电容变化对基于NM的柔性TFT中电​​特性变化的影响。

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  • 来源
    《Applied Physics Letters》 |2016年第23期|233505.1-233505.5|共5页
  • 作者单位

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Wisconsin 53706, USA,Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, South Korea;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Wisconsin 53706, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Wisconsin 53706, USA;

    Department of Electrical Engineering, NanoFAB Center, University of Texas, Arlington, Texas 76019, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Wisconsin 53706, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-18 03:14:39

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