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Effect of BST film thickness on the performance of tunable interdigital capacitors grown by MBE

机译:BST膜厚度对MBE生长的可调式叉指电容器性能的影响

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摘要

Voltage-tunable, interdigital capacitors (IDCs) were fabricated on Ba_(0.29)Sr_(0.71)TiO_3 grown by hybrid molecular beam epitaxy (MBE). In this growth technique, we utilize the metal-organic precursor titanium tetraisopropoxide rather than solid-source Ti as with conventional MBE. Two samples of varying Ba_xSr_((1-X))TiO_3 (BST) thicknesses were fabricated and analyzed. High-quality, epitaxial Pt electrodes were deposited by sputtering from a high-purity Pt target at 825 ℃. The Pt electrodes were patterned and etched by argon ion milling, passivated with reactively sputtered SiO_2, and then metallized with lift-off Ti/Au. The fabricated devices consisted of two-port IDCs embedded in ground-signal-ground, coplanar waveguide (CPW) transmission lines to enable radio-frequency (RF) probing. The sample included open and thru de-embedding structures to remove pad and CPW parasitic impedances. Two-port RF scattering (S) parameters were measured from 100 MHz to 40 GHz while DC bias was stepped from 0 V to 100 V. The IDCs exhibit a high zero-bias radio-frequency (RF) quality factor (Q) approaching 200 at 1 GHz and better than 2.3:1 capacitance tuning for the 300-nm-thick sample. Differences in the Q(V) and C(V) response with varying thicknesses indicate that unknown higher order material phenomena are contributing to the loss and tuning characteristics of the material.
机译:在通过混合分子束外延(MBE)生长的Ba_(0.29)Sr_(0.71)TiO_3上制造了电压可调叉指电容器(IDC)。在这种生长技术中,我们利用金属有机前体四异丙氧基钛,而不是像常规MBE那样使用固体源Ti。制作并分析了Ba_xSr _((1-X))TiO_3(BST)厚度不同的两个样品。在825℃的高纯度Pt靶上通过溅射沉积高质量的外延Pt电极。通过氩离子铣削对Pt电极进行构图和蚀刻,然后用反应溅射的SiO_2进行钝化,然后用剥离Ti / Au进行金属化。所制造的设备由嵌入在地面信号-地面共面波导(CPW)传输线中的两端口IDC组成,以实现射频(RF)探测。该样本包括开放式和直通去嵌入结构,以消除焊盘和CPW的寄生阻抗。在100 MHz至40 GHz的范围内测量了两端口RF散射(S)参数,而DC偏置从0 V逐步提升至100V。IDC的零偏射频(RF)品质因数(Q)高达200对于300 nm厚的样品,在1 GHz频率下的电容调谐优于2.3:1。不同厚度的Q(V)和C(V)响应的差异表明,未知的高阶材料现象正在影响材料的损耗和调谐特性。

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  • 来源
    《Applied Physics Letters》 |2017年第26期|262903.1-262903.4|共4页
  • 作者单位

    Department of Electrical and Computer Engineering, University of California at Santa Barbara (UCSB), Santa Barbara, California 93106, USA;

    Materials Department, University of California at Santa Barbara (UCSB), Santa Barbara, California 93106,USA;

    Materials Department, University of California at Santa Barbara (UCSB), Santa Barbara, California 93106,USA;

    Department of Electrical and Computer Engineering, University of California at Santa Barbara (UCSB), Santa Barbara, California 93106, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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  • 入库时间 2022-08-18 03:14:27

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