首页> 外文期刊>Applied Physics Letters >Selective electroless plating of 3D-printed plastic structures for three-dimensional microwave metamaterials
【24h】

Selective electroless plating of 3D-printed plastic structures for three-dimensional microwave metamaterials

机译:三维微波超材料的3D打印塑料结构的选择性化学镀

获取原文
获取原文并翻译 | 示例
           

摘要

A technique of selective electroless plating onto PLA-ABS (Polylactic Acid-Acrylonitrile Butadiene Styrene) composite structures fabricated by three-dimensional (3D) printing is demonstrated to construct 3D microwave metamaterials. The reducing activity of the PLA surface is selectively enhanced by the chemical modification involving Sn~(2+) in a simple wet process, thereby forming a highly conductive Ag-plated membrane only onto the PLA surface. The fabricated metamaterial composed of Ag-plated PLA and non-plated ABS parts is characterized experimentally and numerically to demonstrate the important bi-anisotropic microwave responses arising from the 3D nature of metallodielectric structures. Our approach based on a simple wet chemical process allows for the creation of highly complex 3D metal-insulator structures, thus paving the way toward the sophisticated microwave applications of the 3D printing technology.
机译:通过三维(3D)打印制造的PLA-ABS(聚乳酸-丙烯腈-丁二烯-苯乙烯)复合结构上的选择性化学镀技术被证明可以构造3D微波超材料。在简单的湿法工艺中,通过涉及Sn〜(2+)的化学修饰选择性地增强了PLA表面的还原活性,从而仅在PLA表面上形成了高导电性的镀银膜。由镀银的PLA和未镀的ABS零件组成的预制超材料通过实验和数值表征,以证明金属介电结构的3D性质引起的重要的双各向异性微波响应。我们基于简单的湿法化学工艺的方法可以创建高度复杂的3D金属绝缘体结构,从而为3D打印技术在复杂的微波应用方面铺平了道路。

著录项

  • 来源
    《Applied Physics Letters》 |2017年第18期|183102.1-183102.4|共4页
  • 作者单位

    Department of Electrical and Electronic Engineering, Okayama University, 3-1-1 Tsushimanaka, Kitaku, Okayama 700-8530, Japan;

    Department of Electrical and Electronic Engineering, Okayama University, 3-1-1 Tsushimanaka, Kitaku, Okayama 700-8530, Japan;

    Department of Chemistry, Okayama University, 3-1-1 Tsushimanaka, Kitaku, Okayama 700-8530, Japan;

    Department of Electrical and Electronic Engineering, Okayama University, 3-1-1 Tsushimanaka, Kitaku, Okayama 700-8530, Japan;

    Department of Electrical and Electronic Engineering, Okayama University, 3-1-1 Tsushimanaka, Kitaku, Okayama 700-8530, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号