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首页> 外文期刊>Applied physics express >Investigation Of Near-interface Traps Generated By No Direct Oxidationin C-face 4h-sic Metal-oxide-semiconductor Structures
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Investigation Of Near-interface Traps Generated By No Direct Oxidationin C-face 4h-sic Metal-oxide-semiconductor Structures

机译:C面4h-sic金属氧化物半导体结构中未发生直接氧化的近界面陷阱的研究

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摘要

Characteristics of metal-oxide-semiconductor (MOS) capacitors and MOS field-effect transistors (MOSFETs) fabricated by direct oxidation of C-face 4H-SiC in NO were investigated. It was found from capacitance-voltage (C-V) measurements that interface state density (D_(it)) at energies near the conduction band edge is reduced by direct oxidation of C-face 4H-SiC in NO, whereas this process generates near-interface traps (NITs) in the oxide. These traps capture channel mobile electrons and degrade the performance of MOSFETs. Both the interface states and the near-interface traps were reduced by unloading the samples at room temperature after the oxidation. It is important to reduce not only the interface states but also the near-interface traps to fabricate high-performance C-face 4H-SiC MOSFETs with nitrided gate oxide.
机译:研究了C面4H-SiC在NO中直接氧化制备的金属氧化物半导体(MOS)电容器和MOS场效应晶体管(MOSFET)的特性。从电容-电压(CV)测量中发现,通过在NO中C面4H-SiC的直接氧化,降低了导带边缘附近能量处的界面态密度(D_(it)),而该过程产生了近界面在氧化物中捕获(NIT)。这些陷阱会捕获沟道移动电子并降低MOSFET的性能。通过在氧化后在室温下卸载样品,降低了界面态和近界面陷阱。重要的是,不仅要减少界面状态,而且要减少近界面陷阱,以制造具有氮化栅极氧化物的高性能C面4H-SiC MOSFET。

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