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Effects of substrate leakage and drain-side thermal barriers in In_(0.53)Ga_(0.47)As/GaAs_(0.5)Sb_(0.5) quantum-well tunneling field-effect transistors

机译:In_(0.53)Ga_(0.47)As / GaAs_(0.5)Sb_(0.5)量子阱隧穿场效应晶体管中衬底泄漏和漏极侧热障的影响

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摘要

The device leakage current and the ON-state characteristics of In_(0.53)Ga_(0.47)As/GaAs_(0.5)Sb_(0.5) quantum-well tunneling field-effect transistors (QWTFETs) are examined on the basis of temperature-dependent measurements. Different from commonly observed Shockley-Reed-Hall (SRH) recombination in the OFF-state, substrate leakage is identified as the source of OFF-current, which limits the steepness of the device transfer characteristics. In addition, analysis of the TFET operation in the linear regime reveals a current barrier due to an ungated region near the drain, which accounts for the unexpected parasitic resistance and current saturation at low temperatures. This barrier can be eliminated by reducing the gate-to-drain distance, as illustrated by device simulations. The applied methodology provides a design guideline for the gate-to-drain alignment tolerance in TFETs.
机译:基于温度相关的测量,研究了器件泄漏电流和In_(0.53)Ga_(0.47)As / GaAs_(0.5)Sb_(0.5)量子阱隧穿场效应晶体管(QWTFET)的导通状态特性。与通常在OFF状态下观察到的Shockley-Reed-Hall(SRH)重组不同,衬底泄漏被确定为OFF电流的来源,这限制了器件传输特性的陡度。另外,对线性场效应晶体管(TFET)工作情况的线性分析表明,由于漏极附近的未栅极化区域而产生的电流屏障,这说明了低温下意外的寄生电阻和电流饱和。如器件仿真所示,可以通过减小栅极到漏极的距离来消除该势垒。应用的方法为TFET中的栅极到漏极对准公差提供了设计指南。

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  • 来源
    《_Applied Physics Express》 |2014年第9期|094201.1-094201.4|共4页
  • 作者单位

    Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.;

    Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.;

    Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.;

    Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.;

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