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RF Applications Drive Semiconductor Process Technology Choices

机译:射频应用推动半导体工艺技术的选择

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In recent years, consumers' appetite for cellular phones and other wireless products has driven an enormous market for semiconductors and other electronic and mechanical components. All of these wireless products rely on battery technology to provide power, and on low power semiconductors to maximize battery life. These commercial opportunities and technical requirements ultimately create the motivation to develop semiconductor processes and manufacture products that can meet such challenging technical demands. This article will take a look at three specific semiconductor processes providing an overview of each. Additionally, a comparison of three dual band LNA products designed using these different process technologies will be presented. Suggestions will be made on which technology is best suited for some of the key functions within a cellular phone or other wireless system. The three technologies that will be discussed are gallium arsenide (GaAs) hetero-junction bipolar transistor (HBT); silicon germanium (SiGe) bipolar/complementary metal oxide semiconductor (BiCMOS); and silicon BiCMOS. The basic transistor and passive component attributes will be provided, allowing the reader to compare these process technologies based on their own specific circuit performance requirements. The majority of data presented will be based on IBM's 4S BiCMOS process, IBM's 5HP SiGe BiCMOS process and RF Micro Devices' GaAs HBT process.
机译:近年来,消费者对蜂窝电话和其他无线产品的需求推动了半导体以及其他电子和机械组件的巨大市场。所有这些无线产品都依靠电池技术来提供电源,并依靠低功率半导体来最大化电池寿命。这些商业机会和技术要求最终激发了开发半导体工艺和制造能够满足这种挑战性技术要求的产品的动力。本文将介绍三种特定的半导体工艺,并对每种工艺进行概述。此外,将介绍使用这些不同工艺技术设计的三种双频段LNA产品的比较。将就哪种技术最适合蜂窝电话或其他无线系统中的某些关键功能提出建议。将要讨论的三种技术是砷化镓(GaAs)异质结双极晶体管(HBT);硅锗(SiGe)双极/互补金属氧化物半导体(BiCMOS);和硅BiCMOS。将提供基本的晶体管和无源组件属性,使读者可以根据自己的特定电路性能要求比较这些工艺技术。呈现的大部分数据将基于IBM的4S BiCMOS工艺,IBM的5HP SiGe BiCMOS工艺和RF Micro Devices的GaAs HBT工艺。

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