Expression of phenol oxidase and heat-shock genes during the development of Agaricus bisporus fruiting bodies, healthy and infected by Lecanicillium fungicola

摘要

The fungal pathogen Lecanicillium fungicola (formerly Verticillium fungicola) is responsible for severe losses worldwide in the mushroom (Agaricus bisporus) industry. Infected crops are characterised by masses of undifferentiated tissue (bubbles) growing in place of sporophores. The expression of three laccase genes (lcc1, lcc2 and lcc3), two tyrosinase genes (AbPPO1 and AbPPO2) and the hspA gene encoding a heat-shock protein known to be potentially associated with host–pathogen interaction was investigated in mycelial aggregates and during the development of healthy sporophores and bubbles of a susceptible cultivar. The lcc3, AbPPO2 and hspA genes were each expressed at different levels at the different stages of sporophore morphogenesis, whilst they showed a stable expression throughout bubble development. The transcript levels were similar in bubbles and at the first developmental stage of healthy fruiting bodies, both showing no tissue differentiation. These observations suggest that lcc3, AbPPO2 and hspA are associated with A. bisporus morphogenesis. Comparing the expression of the hspA gene in three susceptible and three tolerant strains showed that the latter displayed a higher level of transcript in the primordium, which is the stage receptive to the pathogen. The six strains exhibited a comparable expression in the vegetative mycelium, non-receptive to L. fungicola. Keywords Fungal pathogen - Mushroom - Gene expression - HSP70 - Laccase - Tyrosinase