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Change-point detection of failure mechanism for electronic devices based on Arrhenius model

机译:基于Arrhenius模型的电子设备故障机制的变化点检测

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In this paper, we consider the abrupt change-point and continuous change-point failure mechanisms in the accelerated life tests of electronic devices and propose corresponding detection methods based on the Weibull distribution and the Arrhenius model. The new methods can handle the detection of failure mechanism change-point with censored data and small samples. Comprehensive simulation studies are conducted to test the performance of the proposed methods and investigate the influences of the change location, the parameters and the censored ratios. Results of the simulation studies show that the proposed methods perform well in terms of type 1 errors and powers, and the change of parameters has a stronger impact on the performance of the new methods compared to the change location and censored ratios. In the end, we provide two real-world examples. The new class H insulation example shows that the proposed methods can predict the reliability reasonably well by detecting the change point, and the metal oxide semiconductor transistor example shows that the new methods can greatly reduce the experimental time and provide accurate reliability predictions.
机译:在本文中,我们考虑了电子设备加速寿命试验中的突然变化点和连续变化点故障机制,并提出了基于Weibull分布和Arrhenius模型的相应检测方法。新方法可以处理失败机制变更点的检测,具有缩短的数据和小型样本。进行综合模拟研究以测试所提出的方法的性能,并调查变化位置,参数和审查比率的影响。仿真研究结果表明,该方法在1型错误和功率方面表现良好,与变化位置和截取比率相比,参数的变化对新方法的性能具有更强的影响。到底,我们提供了两个真实的例子。新的H绝缘实例表明,所提出的方法可以通过检测变化点来预测可靠性,并且金属氧化物半导体晶体管示例示出了新方法可以大大减少实验时间并提供准确的可靠性预测。

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