Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration

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• 来源
  《IEEE Antennas and Wireless Propagation Letters》 |2019年第11期|2345-2350|共6页
• 作者

  Hong Wonbin; Maaskant Rob; Liu Duixian; Wang Hua; Shamim Atif; Smolders Bart; Manteuffel Dirk; Zhang Yueping;

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• 作者单位

  Pohang Univ Sci & Technol Dept Elect Engn Pohang 37673 South Korea;

  Eindhoven Univ Technol NL-5612 AZ Eindhoven Netherlands|Chalmers Univ Technol Signals & Syst Dept Antenna Grp S-41296 Gothenburg Sweden;

  IBM Corp TJ Watson Res Ctr Yorktown Hts NY 10598 USA;

  Georgia Inst Technol Sch Elect & Comp Engn Georgia Tech Elect & Microsyst Lab Atlanta GA 30332 USA;

  King Abdullah Univ Sci & Technol Elect Engn Program Thuwal 23955 Saudi Arabia;

  Eindhoven Univ Technol Electromagnet Grp NL-5612 AZ Eindhoven Netherlands;

  Leibniz Univ Hannover Inst Microwave & Wireless Syst D-30167 Hannover Germany;

  Nanyang Technol Univ Sch Elect & Elect Engn Singapore 639798 Singapore;

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• 原文格式 PDF
• 正文语种 eng
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