Removing Cured Silicone Adhesive from Electronic Components

摘要

Quaternary ammonium fluoride reagent TBAF in PMA is effective in removing cured silicone adhesives from electronic components. This rework process is simple and efficient for all types of silicone adhesives, and compatible with all module materials and contacting surfaces. Additionally, it adapts to manual or automated cleaning modes with no major safety or regulatory issues, and the water-soluble organic residue after filler filtration and solvent recovery enables low-cost waste disposal.