Method for coating e.g. chip-on-board UV-LED module utilized in solar cell, involves curing and cross-linking liquid silicone with optoelectronic components and carriers, and removing carrier with hardened silicone coating from mold

摘要

The method involves pouring a liquid silicone in an upwardly opened mold, which exhibits an external dimension exceeding corresponding to outer dimensions of carriers (2, 2'). The carriers are inserted into the mold such that optoelectronic components i.e. LEDs (4, 4'), are completely immersed into the silicone. The carriers are partially dipped over an entire surface in the silicone. The silicone is cured and cross-linked with the optoelectronic components and the carriers. The carriers are removed with a hardened silicone coating from the mold. An independent claim is also included for an optoelectronic chip on board module.