Handling Ultra-thin Wafers: Mobile Electrostatic Carriers Enable Bumping

摘要

Manufacturing technologies for 50-to 150-μm thin wafers are a basic need for a wide variety of microelectronic products. Further technological developments are targeting stacked-die assemblies, vertical system integration, and many new ideas for MEMS devices, which are based on wafer-bonding technologies. These require new handling techniques for processes that must be performed on the backside of thin or fragile substrates.