...
首页> 外文期刊>IEEE Transactions on Advanced Packaging >Equivalent network synthesis for via holes discontinuities
【24h】

Equivalent network synthesis for via holes discontinuities

机译:通孔不连续性的等效网络综合

获取原文
获取原文并翻译 | 示例
           

摘要

A methodology is presented for the synthesis of the passive equivalent circuit of via holes in multilayer printed circuit boards. The paper describes the network synthesis starting from the extraction of the poles and residues from the driving point transfer functions for two port networks. The via hole is partitioned into elementary structures assumed not electromagnetically coupled and the scattering parameters for each one of them are evaluated by using a numerical approach suitably validated by comparison with results computed by other independent numerical methods. The equivalent circuit of the complete via hole is given by the cascading of the circuits of the elementary structures. The proposed technique is validated by comparing the computed scattering parameters with those from measurements for real test boards.
机译:提出了一种用于合成多层印刷电路板中通孔的无源等效电路的方法。本文从两个端口网络的驱动点传递函数中提取极点和残差开始,描述了网络综合。将通孔划分为假定未电磁耦合的基本结构,并通过使用一种数值方法来评估它们中每一个的散射参数,该数值方法通过与其他独立数值方法所计算的结果进行比较来适当验证。完整通孔的等效电路由基本结构的电路级联给出。通过将计算的散射参数与实际测试板的测量参数进行比较,可以验证所提出的技术。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号