Antiadhesion Surface Treatments of Molds for High-Resolution Unconventional Lithography

摘要

A new strategy is needed for the mass production of micro-and nanostructures on a wide variety of substrates, which can be applied in various fields of manufacturing, for example, microelectronics, micro-optics, photonics, and chemical or biosensors. Since the early 1990s, simple unconventional lithographic techniques, such as soft lithography, imprint lithog-raphy, and others, have been developed for the economical and rapid fabrication of micro and nanostructures applicable to various fields of electronics and optics. However, as the feature size diminishes rapidly, a grand challenge that remains to be overcome is the fabrication of dense and complex nanostructures with high aspect ratios, and, in this process, accomplishing the complete release of the mold from the patterned substrate becomes essential. For this reason, many research efforts are directed towards lowering the adhesion between the mold and the patterned polymer on a substrate.