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Scalable Fabrication of Ambipolar Transistors and Radio-Frequency Circuits Using Aligned Carbon Nanotube Arrays

机译:使用对准的碳纳米管阵列的双极晶体管和射频电路的可扩展制造

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摘要

Electronic devices based on carbon nanotubes (CNTs) have attracted significant attention for potential radio frequency (RF) applications. It has been shown that intrinsic current-gain and power-gain cutoff frequencies (ƒ_T and ƒ_(max)) above 1 THz should be possible, but experimental demonstration using field-effect transistors (FETs) based on individual CNTs has suffered from excessive parasitic effects and impedance mismatch prob-lems. In order to overcome these limitations, great efforts have been concentrated on FETs made from aligned arrays of CNTs. Since all of the published A-CNT RF circuits were designed to work in the linear region, it is often stated that it is necessary to use dense arrays of all-semiconducting nanotubes to achieve high performance. While impressive progress has been made in achieving high-density arrays of CNTs, for example in several cases the required density of tens of nanotubes per micrometer has been realized, it is still challenging to eliminate all metallic CNTs without damaging semiconducting CNTs and thus severely degrading the performance of the CNT-array FETs.
机译:对于潜在的射频(RF)应用,基于碳纳米管(CNT)的电子设备引起了极大的关注。已经显示出高于1 THz的固有电流增益和功率增益截止频率(ƒ_T和ƒ_(max))应该是可能的,但是使用基于单个CNT的场效应晶体管(FET)进行的实验演示遭受了过多的寄生效应效应和阻抗失配问题。为了克服这些局限性,已经集中精力在由对齐的CNT阵列制成的FET上。由于所有已发布的A-CNT RF电路均设计为在线性区域内工作,因此经常有人指出,有必要使用全半导体纳米管的密集阵列来实现高性能。尽管在实现高密度的CNT阵列方面已经取得了令人瞩目的进展,例如,在某些情况下,已经实现了所需的每微米几十个纳米管的密度,但要消除所有金属CNT而又不损坏半导体CNT并因此严重降解仍然是一个挑战。 CNT阵列FET的性能。

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  • 来源
    《Advanced Materials》 |2014年第4期|645-652|共8页
  • 作者单位

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

    Microwave Devices and Integrated Circuits Department Institute of Microelectronics Chinese Academy of Sciences Beijing, 100029, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

    Department of Chemistry Duke University Durham, North Carolina, 27708, USA;

    Department of Chemistry Duke University Durham, North Carolina, 27708, USA;

    Key Laboratory for the Physics and Chemistry of Nanodevices and, College of Chemistry and Molecular Engineering Peking University Beijing, 100871, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices and, College of Chemistry and Molecular Engineering Peking University Beijing, 100871, PR China;

    Key Laboratory for the Physics and Chemistry of Nanodevices, and Department of Electronics Peking University Beijing, 100871, PR China;

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