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DNA Repair Synthesis and Ligation Affect the Processing of Excised Oligonucleotides Generated by Human Nucleotide Excision Repair

机译:DNA修复的合成和连接影响人核苷酸切除修复产生的寡核苷酸的加工过程。

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摘要

Ultraviolet (UV) photoproducts are removed from genomic DNA by dual incisions in humans in the form of 24- to 32-nucleotide-long oligomers (canonical 30-mers) by the nucleotide excision repair system. How the small, excised, damage-containing DNA oligonucleotides (sedDNAs) are processed in cells following the dual incision event is not known. Here, we demonstrate that sedDNAs are localized to the nucleus in two biochemically distinct forms, which include chromatin-associated, transcription factor II H-bound complexes and more readily solubilized, RPA-bound complexes. Because the nuclear mobility and repair functions of transcription factor II H and RPA are influenced by post-incision gap-filling events, we examined how DNA repair synthesis and DNA ligation affect sedDNA processing. We found that although these gap filling activities are not essential for the dual incision/sedDNA generation event per se, the inhibition of DNA repair synthesis and ligation is associated with a decrease in UV photoproduct removal rate and an accumulation of RPA-sedDNA complexes in the cell. These findings indicate that sedDNA processing and association with repair proteins following the dual incisions may be tightly coordinated with gap filling during nucleotide excision repair in vivo.
机译:通过核苷酸切割修复系统,通过在人类中以24至32个核苷酸长的寡聚体(规范的30个聚体)的形式在人类中进行两次切口,从基因组DNA中去除了紫外线(UV)光电产物。未知双重切割事件后如何在细胞中处理切成小块,包含损伤的DNA寡核苷酸(sedDNA)。在这里,我们证明sedDNAs以两种生化独特的形式位于细胞核中,包括染色质相关的转录因子II H结合复合物和更易溶解的RPA结合复合物。由于转录因子II H和RPA的核迁移和修复功能受切口后缺口填充事件的影响,因此我们研究了DNA修复合成和DNA连接如何影响sedDNA加工。我们发现,尽管这些间隙填充活性本身并不是双重切口/ sedDNA产生事件所必需的,但DNA修复合成和连接的抑制与UV光产物去除速率的降低和RPA-sedDNA复合物在皮肤中的积累有关。细胞。这些发现表明,在双核苷酸切割后,sedDNA的加工以及与修复蛋白的结合可能与体内核苷酸切除修复过程中的缺口填补紧密相关。

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